dim800ecm33 - f000 igbt chopper module replaces ds5815 - 1.2 ds5815 - 3 september 2012 (ln 29759 ) caution : this device is sensitive to electrostatic discharge. users should follow esd handling procedures 1 / 8 www.dynexsemi.com features ? 10s short circuit withstand ? high thermal cycling capability ? soft punch through silicon ? isolated alsic base with aln substrates ? lead free c onstruction applications ? motor controllers ? power supplies ? choppers the powerline range of high power mo dules includes half bridge, chopper, dual, single and bi - directional switch configurations covering voltages from 12 00v to 65 00v and currents up to 2400a. the dim 800e cm33 - f000 is a 33 00v, soft punch through n - channel enhancement mode, insulated gate bipol ar transistor (igbt) chopper module. the igbt has a wide reverse bias safe operating area (rbsoa) plus 10s short circuit withstand. this device is optimised for traction drives and other applications requiring high thermal cycling capability. the module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety . ordering information order as: dim 800e cm33 - f000 note: when ordering, pl ease use the complete part number key parameters v ces 33 00 v v ce(sat) * (typ) 2.8 v i c (max) 8 00 a i c(pk) (max) 16 00 a * measured at the auxiliary terminals fig. 1 circuit configuration outline type code: e (see fig. 11 for further inf ormation) fig. 2 package 5(a) 4(k) 2(g) 1(e) 3(c) 8(e) 6(e) 7(c) 9(c)
dim 800ecm33 - f000 2 /8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com absolute maximum ratings stresses above those listed under absolute maximum ratings may cause permanent damage to the device. in extreme conditions, as with all semiconductors, this may include potentially hazardous rupture o f the package. appropriate safety precautions should always be followed. exposure to absolute maximum ratings may affect device reliability. t case = 25c unless stated otherwise symbol parameter test conditions max. units v ces collector - emitter voltage v ge = 0v 3 300 v v ges gate - emitter voltage 20 v i c continuous collector current t case = 90 c 8 00 a i c(pk) peak collector current 1ms, t case = 115 c 16 00 a p max max. transistor power dissipation t case = 25c, t j = 150c 10400 w i 2 t diode i 2 t value (i gbt arm) v r = 0, t p = 10ms, t j = 125oc 320 ka 2 s diode i 2 t value (diode arm) 320 ka 2 s v isol isolation voltage C per module commoned terminals to base plate. ac rms, 1 min, 50hz 6000 v q pd partial discharge C per module iec1287, v 1 = 35 00v, v 2 = 26 00v, 50hz rms 10 pc thermal and mechanical ratings internal insulation material: aln baseplate material: alsic creepage distance: 33 mm clearance: 20 mm cti (comparative tracking index): >600 symbol parameter test conditions min typ. max units r th( j - c) thermal resistance C C th(j - c) thermal resistance C C C th(c - h) thermal resistance C j junction temperature transistor - - 150 c diode - - 125 c t stg storage temperature range - - 40 - 125 c screw torque mounti ng C C C
dim 800ecm33 - f000 caution : this device is sensitive to electrostatic discharge. users should follow esd handling procedures 3 / 8 www.dynexsemi.com electrical characteristics t case = 25 c unless stated otherwise. symbol parameter test conditions min typ max units i ces collector cut - off current v ge = 0v, v ce = v ces 4 ma v ge = 0v, v ce = v ces , t case = 125c 60 ma i ges gate leakage current v ge = 20 v, v ce = 0v 1 a v ge(th) gate threshold voltage i c = 8 0ma, v ge = v ce 5 .5 6 .5 7 . 0 v v ce(sat) ? collector - emitter saturation voltage v ge = 15v, i c = 8 00a 2.8 v v ge = 15v, i c = 8 00a, t j = 125c 3.6 v i f diode forward current dc 800 a i fm diode maximum forward current t p = 1ms 1600 a v f ? diode forward voltage (igbt arm) i f = 8 00a 2.9 v diode forward voltage (diode arm) 2.9 v di ode forward voltage (igbt arm) i f = 8 00a, t j = 125c 3.0 v diode forward voltage (diode arm) 3.0 v c ies input capacitance v ce = 25v, v ge = 0v, f = 1mhz 144 nf q g gate charge 15v 20 c c res reverse transfer capacitance v ce = 25v, v ge = 0v, f = 1mhz 2.2 nf l m module inductance C igbt arm 15 nh r int internal resistance C igbt arm 135 ? sc data short circuit current, i sc t j = 125c, v cc = 25 00v t p 10s, v ge 15v v ce (max) = v ces C l * x di/dt iec 60747 - 9 3700 a note: ? me asured at the auxiliary terminals * l is the circuit inductance + l m
dim 800ecm33 - f000 4 /8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com electrical characteristics t case = 25c unless stated otherwise symbol parameter test conditions min typ. max units t d(off) t urn - off delay time i c = 800a v ge = 15v v ce = 1800v c ge = 220nf l s ~ 100nh r g(on) = 3.9 ? r g(off) = 6.2 ? 3.0 s t f fall time 270 ns e off turn - off energy loss 1050 mj t d(on) turn - on delay time 1300 ns t r rise time 275 ns e on turn - on energy loss r g(on) = 2.7 ? r g(off) = 6.2 ? 1250 mj q rr diode reverse recovery charge i f = 800a v ce = 1800v di f /dt = 4000a/s 320 c i rr diode reverse recovery current 670 a e rec diode reverse recovery energy 300 mj t case = 125c unless stated otherwise symbol parameter test conditions min typ. max units t d(off) turn - off delay time i c = 800a v ge = 1 5v v ce = 1800v c ge = 220nf l s ~ 100nh r g(on) = 3.9 ? r g(off) = 6.2 ? 3.1 s t f fall time 280 ns e off turn - off energy loss 1200 mj t d(on) turn - on delay time 1200 ns t r rise time 315 ns e on turn - on energy loss r g(on) = 2.7 ? r g(off) = 6. 2 ? 1750 mj q rr diode reverse recovery charge i f = 800a v ce = 1800v di f /dt = 4000a/s 600 c i rr diode reverse recovery current 800 a e rec diode reverse recovery energy 600 mj
dim 800ecm33 - f000 caution : this device is sensitive to electrostatic discharge. users should follow esd handling procedures 5 / 8 www.dynexsemi.com fig. 3 typical output characteristics fig. 4 typical output characteristics fig. 5 typical switching energy vs collector current fig. 6 typical switching energy vs gate resistance
dim 800ecm33 - f000 6 /8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com fig. 7 diode typical forward characteristics fig. 8 reverse bias safe operating area fig . 9 diode reverse bias safe operating area fig. 10 transient thermal impedance
dim 800ecm33 - f000 caution : this device is sensitive to electrostatic discharge. users should follow esd handling procedures 7 / 8 www.dynexsemi.com package details for further package information, please visit our website or contact customer services. all dimensions in mm, unless stated otherwise. do not scale. nominal weight: 14 00g module outline type code: e fig. 11 module outline drawing screwing depth max. 16 screwing depth max. 8 6 x m8 3 x m4 dim....esm....... dim....ecm....... dfm....exm....... 7 external connection external connection 5(c) 7(c) 4(e) 6(e) 9(c) 8(e) external connection external connection 3(c) 2(g) 1(e) 7(c) 9(c) 6(e) 8(e) 5(c) 4(e) external connection external connection 3(c) 2(g) 1(e) 5(c) 7(c) 4(e) 6(e) 9(c) 8(e) 8 x 7 ? 57 0.1 171 0.15 190 0.5 20 0.1 40 0.2 124 0.1 140 0.5 79.4 0.2 41.25 0.2 20.25 0.2 61.5 0.3 61.5 0.3 13 0.2 5 0.2 38 0.5 5.2 0.2 40 0.2 28 0.5
dim 800ecm33 - f000 8 /8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com important information: this publication is provided for information only and not for resale. the products and information in this publication are intended for use by appropriately trained technical personnel. due to the diversity of product applications, the information contained herein is provided as a general guide only and does n ot constitute any guarantee of suitability for use in a specific applicatio n . the user must evaluate the suitability of the product and the completeness of the product data for the application. the user is responsible for product selection and ensuring all safety and any warning requirements are met. should additional product information be needed please contact customer service. although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical errors. the information is provided without any warranty or guarante e of any kind. this publication is an uncontrolled document and is subject to change without notice. when referring to it please ensure that it is the most up to date version and has not been superseded. the products are not intended for use in applicat ions where a failure or malfunction may cause loss of life, injury or damage to property. the user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or malfunction. the products must no t be touched when operating because there is a danger of electrocution or severe burning. always use protective safety equipment such as appropriate shields for the product and wear safety glasses. even when disconnected any electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves. extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. use outside the product ratings is l ikely to cause permanent damage to the product. in extreme conditions, as with all semiconductors, this may include potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. appropriate application des ign and safety precautions should always be followed to protect persons and property. product status & product ordering: we annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully appr oved for production. the annotations are as follows: - target information: this is the most tentative form of information and represents a very preliminary specification. no actual design work on the product has been started. preliminary information: the pro duct design is complete and final characterisation for vo lume production is in progress. the datasheet represents the product as it is now understood but details may change. no annotation: the product has been approved for production and unless otherwise notified by dynex any product ordered will be supplied to the current version of the data sheet prevailing at the time of our order acknowledgement. all products and materials are sol d and services provided subject to dynexs conditions of sale, which are available on request. any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. headquarters oper ations customer service dynex semiconductor ltd doddington road, lincoln, lincolnshire, ln6 3lf, united kingdom dynex semiconductor ltd doddington road, lincoln, lincolnshire, ln6 3lf, united kingdom fax: +44(0)1522 500550 fax: +44(0)1522 500020 tel: + 44(0)1522 500500 tel: +44(0)1522 502753 / 502901 web: http://www.dynexsemi.com email: power_solutions@dynexsemi.com ? dynex semiconductor ltd. 2004 technical documentation C not for resale.
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